Indium 801216 - Solder Paste, Water Soluble, Lead-Free, T3, 88.8%, SAC305, 500g Jar

Name: Indium 801216 - Solder Paste, Water Soluble, Lead-Free, T3, 88.8%, SAC305, 500g Jar
Brand: Indium
SKU: Indium801216
Price: 709.66 USD
Availability: InStock

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Solder Paste, Water Soluble, Lead-Free, T3, 88.8%, SAC305, 500g Jar-Note:Price is for 7 Units

Alloy: Sn96.5Ag3Cu0.5
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Flux Type: ORH1
Powder Mesh Size: T3
Lowest voiding water-soluble flux for solder paste
Exceptional printing process window
Wide reflow process window for profiling
Excellent wetting on a variety of surface finishes
Maintains tack over time
Suitable for SnPb eutectic alloys as well as Pb-free alloys

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Alloy Type	SAC305	SAC305	Sn63/Pb37	SAC305	Sn63/Pb37	Sn63/Pb37	Sn63/Pb37
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Indium 801216 - Solder Paste, Water Soluble, Lead-Free, T3, 88.8%, SAC305, 500g Jar

Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response to pause.

Indium6.4R exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with the fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs, and BTCs (QFNs, DPAKs, LGAs, etc.)