• Halogen-free per EN14582 test method
• High-performance stencil printing characteristics
• Eliminates hot and cold slump
• High oxidation resistance
• Clear, probe-testable post-reflow residues

RMA-155 is an air reflow, RMA solder paste formulated to accommodate a variety of alloys for electronics assembly. Its balanced performance is suited for a wide variety of processes including consistent stencil printing transfer, robust reflow window, and residue compatible with in-circuit testing.

RMA-155 is designed to be reliable without needing to be cleaned. However, the flux can be removed, if necessary, by using a commercially available flux residue remover (i.e., semi-aqueous, solvent-based, or vapor degreaser).