Alloys

Indium Corporation manufactures low-oxide spherical powder composed of eutectic Sn/Pb and Sn/Pb/Ag in the industry standard Type 3 mesh size (J-STD-006). Other non-standard mesh sizes are available upon request. The weight ratio of the flux/vehicle to the solder powder is referred to as the metal load and is typically in the range of 80–92% for standard alloy compositions.

Storage and Handling Procedures

Refrigerated storage will prolong the shelf life of solder paste. The shelf life of Indium6.3 is 4 months when stored at <10°C. When storing solder paste contained in syringes and cartridges, the packages should be stored with the tip down.

Solder paste should be allowed to reach ambient working temperature prior to use. Generally, the paste should be removed from refrigeration at least 2 hours before use. The actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verified before use. Jars and cartridges should be labeled with the date and time of opening.