The Hakko FR-1418 BGA rework system is designed for the manual alignment and placement or removal of BGA, μBGA, CSP and other surface mount components with repeatable solder reflow profiles.

The FR-1418 is constructed of heavy-walled aluminum castings for unsurpassed precision and stability and uses precisely controlled solder reflow profiles. The system features a unique gantry style construction similar to that of a pick-and-place machine, which allows the PCB to remain stationary while the head moves to accomplish the X, Y, Z and Theta alignment.

The Z-axis travel and component placement is manually controlled. The bottom heater is a single zone (10 x 12 inches) large area, low mass infra-red heater that provides fast, efficient heating and eliminates board warping. The Hakko FR-1418 BGA rework system is designed for the manual alignment and placement or removal of BGA, µBGA, CSP and other surface mount components with repeatable solder reflow profiles.

Gantry System
	Unique gantry system allows the PCB to remain stationary while the head is manually moved to accomplish the X, Y, Z and Theta alignment. The design allows the capacity to rework boards up to 14 x 18 inches in a smaller footprint with simple board fixture. Rigid structure for stability and accurate component placement.
Rapid movement handle allows fast, easy X-Y alignment along smooth motion gantry. Fine adjust with fine-threaded adjustment knobs
Board And Component Capacity
Board capacity: 2 x 2 inch minimum. 14 x 20 inch maximum. (larger board sizes possible) PCB thickness up to 0.25 inch (6.4 mm). Able to remove components up to 1.5 inches tall. Component sizes: 0.08 inch (2.0 mm) square minimum. 2 inch (51 mm) square maximum. Able to handle both grid array and leaded-typed components (BGA, CGA, QFP, LCC, TSOP and many others.) Placement accuracy to +/- 0.002 inches. Fully adjustable PCB holding fixture standard.
Control System
	Pentium Class PC with Windows-based operating system Recipe controls parameters for Preheat, Soak, Reflow, and Cool Down Unlimited recipe storage Advanced, automatic profiling capabilities Video capture card with flat screen monitor provides clear viewing during component placement "Teach" mode profiling sets the recipe times based on the input operating and target temperatures Password protection prevents unauthorized use or adjustment of recipes
1000W Top Heater
	Forced convection hot gas system Heater head with built in vacuum pick-up and Theta adjustment Various interchangeable vacuum tips and cups available Low, medium, and high gas flow
Infrared Low Mass Pre-heater
	Large area, low mass infra-red heaters provides fast, efficient heating and eliminates board warping Standard: 750W single zone IR array (10x12") Optional: 1500W single zone High Density IR array (10x12") Optional: 1500W dual zone IR array (12x20") Optional: 3000W 240V two zone High Density IR array (12x20") True proportional control (0-100% power) Provides fast, efficient heating and eliminates board warping
Four Thermocouple Input Ports
Real-time process monitoring and development. TEACH, BOARD and two SPARE thermocouples Control system graphs thermocouple temperatures Monitor the temperature under the component and on the surface of the board simultaneously.
Optics
	Beam-splitting prism allows LookUp/LookDown vision with LED lighting Top and bottom lighting independently adjusted Optional Pan and Tilt mirror allows zoom in and scanning of image
CCD Video Camera
	Color, high resolution camera with fixed mirror. Focus, zoom and aperature control