Solderless Breadboard, 300 Tie-Points
The Global Specialties GS-300 has 300 tie-points and offers unlimited circuit design expansion through its unique molded-in interlocking edge rails and standard 0.3" DIP spacing. Molded interlocking edge rails on all four sides permit parallel or perpendicular socket arrays, allowing more boards to be added at any point for maximum circuit design flexibility. The GS-300 is made from high-impact plastic with phosphor bronze contacts. It has a heavy-duty Mylar backing to prevent short circuits.
The GS-300 is a modular type solderless breadboard that connects with the GS-050 bus strip to make a 400-tie point breadboard (GS400). Expandable in two dimensions, it is a great way to prototype low frequency or DC-powered circuits.
They are ideal for:
- Educational labs
- Hobbyists