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Chip Quik TS391SNL50 - SAC305 Thermally Stable Solder Paste (50g Jar)

0 reviews | Model: Chip Quik TS391SNL50


Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (50g jar)

  • Revolutionary Formula: No Refrigeration Required!
  • Alloy: Sn96.5/Ag3.0/Cu0.5
  • Flux Type: Synthetic No-Clean
  • Flux Classification: ROL0
  • Metal Content: 88.5% metal by weight
  • Particle Size: T4 (20-38 microns)
  • Melting Point: 217-220°C (423-428°F)
  • Size: 50g jar
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