The differences in Chip Quik Sn42/Bi57.6/Ag0.4 solder paste are as follows:
• Packaging - syringe, jar and cartridge
• Flux type - no clean, water washable
• Particle size - T3, T4 and T5
• Formula - regular, thermally stable The following is an overview of part numbers for Chip Quik Sn42/Bi57.6/Ag0.4 solder paste: Syringe:
? SMDLTLFP - no clean, 5cc syringe, 15g, T3
? SMDLTLFP10 - no clean, 10cc syringe, 35g, T3
? SMDLTLFP10T4 - no clean, 10cc syringe, 35g, T4
? SMDLTLFP10T5 - no clean, 10cc syringe, 35g, T5
? TS391LT - thermally stable, no clean, 5cc syringe, 15g, T4
? TS391LT10 - thermally stable, no clean, 10cc syringe, 35g, T4 Jar:
? SMDLTLFP15T4 - 15g, two part mix, T4
? SMDLTLFP60T4 - 60g, two part mix, T4
? SMDLTLFP50T3 - 50g, no clean, T3, 90% metal
? SMDLTLFP250T3 - 250g, no clean, T3, 90% metal
? SMDLTLFP250T4 - 250g, no clean, T4, 90% metal
? SMDLTLFP250T5 - 250g, no clean, T5, 89.5% metal
? TS391LT50 - 50g, thermally stable, no clean, T4, 90% metal
? TS391LT250 - 250g, thermally stable, no clean, T4, 90% metal Cartridge:
? SMDLTLFP500T3C - 500g, no clean, T3, 87% metal
? SMDLTLFP500T4C - 500g, no clean, T4, 87% metal
? SMDLTLFP500T5C - 500g, no clean, T5, 86% metal
? TS391LT500C - 500g, no clean, T4, 87% metal
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Answered by Anonymous