The differences in Chip Quik SAC305 solder paste are as follows: • Packaging - syringe, jar and cartridge • Flux type - no clean, water washable • Particle size - T3, T4 and T5 • Formula - regular, thermally stable, and two part mix The following is an overview of part numbers for Chip Quik SAC305 solder paste: Syringe • SMD291SNL - no clean, 5cc syringe 15g, T3 • SMD291SNL10 - no clean, 10cc syringe 35g, T3 • SMD291SNL10T4 - no clean, 10cc syringe 35g, T4 • SMD291SNL10T5 - no clean, 10cc syringe 35g, T5 • SMD4300SNL10 - no clean, 10cc syringe 35g water washable, T3 • SMD4300SNL10T4 - no clean, 10cc syringe 35g water washable, T4 • SMD4300SNL10T5 - no clean, 10cc syringe 35g water washable, T5 • TS391SNL - thermally stable, no clean, 15g syringe, T4 • TS391SNL10 - thermally stable, no clean, 35g syringe, T4 Jar • SMD291SNL15T4 - two part mix, 15g, T4 • SMD291SNL60T4 - two part mix, 60g, T4 • SMD291SNL50T3 - 50g, T3, no clean, 88.5% metal • SMD291SNL250T3 - 250g, T3, no clean, 88.5% metal • SMD291SNL250T4 - 250g, T4, no clean, 88.5% metal • SMD291SNL250T5 - 250g, T5, no clean, 88% metal • SMD4300SNL250T3 - 250g, T3, water washable, 88.75% metal • SMD4300SNL250T4 - 250g, T4, water washable, 88.75% metal • SMD4300SNL250T5 - 250g, T5, water washable, 88.25% metal • TS391SNL50 - 50g, T4, thermally stable, no clean, 88.5% metal • TS391SNL250 - 250g, T4, thermally stable, no clean, 88.5% metal Cartridge • SMD291SNL500T3C - 500g, T3, no clean, 87% metal • SMD291SNL500T4C - 500g, T4, no clean, 87% metal • SMD291SNL500T5C - 500g, T5, no clean, 86% metal • SMD4300SNL500T3C - 500g, T3, water washable, 86% metal • SMD4300SNL500T4C - 500g, T4, water washable, 86% metal • SMD4300SNL500T5C - 500g, T5, water washable 85.5% metal • TS391SNL500C - 500g, T4, thermally stable, no clean, 87% metal

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