SAC305 Solder, No Clean Flux, 5cc Syringe / 15 Grams, T3
Solder Paste no clean Lead-Free in 5cc syringe 15g, w/plunger & tip, T3 mesh, SAC305.
- Alloy: Sn96.5/Ag3.0/Cu0.5
- Flux Type: Synthetic No-Clean
- Flux Classification: REL0
- Metal Content: 87% metal by weight
- Particle Size: T3 (25-45 microns)
- Melting Point: 217-220°C (423-428°F)
- Size: 5cc/15g syringe
Shelf Life
- Refrigerated >6 months, unrefrigerated >2 months
Stencil Life
- >8 hours @ 20-50% RH 22-28°C (72-82°F)
- >4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
- Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
- Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C (68-77°F) before use.