The differences in Chip Quik 63/37 solder paste are as follows: • Packaging - syringe, jar and cartridge • Flux type - no clean, water washable • Particle size - T3, T4 and T5 • Formula - regular, thermally stable The following is an overview of part numbers for Chip Quik 63/37 solder paste: Syringe • SMD291AX - no clean, 5cc syringe 15g, T3 • SMD291AX10 - no clean, 10cc syringe 35g, T3 • SMD291AX10T4 - no clean, 10cc syringe 35g, T4 • SMD291AX10T5 - no clean, 10cc syringe 35g, T5 • SMD4300AX10 - no clean, 10cc syringe 35g water washable, T3 • SMD4300AX10T4 - no clean, 10cc syringe 35g water washable, T4 • SMD4300AX10T5 - no clean, 10cc syringe 35g water washable, T5 • TS391AX - thermally stable, no clean, 15g, T4 • TS391AX10 - thermally stable, no clean, 15g, T4 Jar • SMD291AX250T3 - 250g, T3, no clean, 90.25% metal • SMD291AX250T4 - 250g, T4, no clean 90.25% metal • SMD291AX250T5 - 250g, T5, no clean 89.75% metal • SMD291AX50T3 - 50g, T3, no clean 90.25% metal • SMD4300AX250T3 - 250g, T3, water washable 90% metal • SMD4300AX250T4 - 250g, T4, water washable 90% metal • SMD4300AX250T5 - 250g, T5, water washable 89.5% metal • TS391AX250 - 250g, T4, thermally stable, no clean, 90.25% metal • TS391AX50- 50g, T4, thermally stable, no clean, 90.25% metal Cartridge • SMD291AX500T3C - 500g, T3, no clean 88% metal • SMD291AX500T4C - 500g, T4, no clean 88% metal • SMD291AX500T5C - 500g, T5, no clean 86% metal • SMD4300AX500T3C - 500g, T3, water washable 87% metal • SMD4300AX500T4C - 500g, T4, water washable 87% metal • SMD4300AX500T5C - 500g, T5, water washable 86.5% metal • TS391AX500C - 500g, T4, thermally stable, no clean, 88% metal

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