Smooth Flow Low Temp Solder Paste, Sn42/Bi57.6/Ag0.4, T4 (15g Syringe)
Chip Quik? solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal powder. Chip Quik? solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you have any issues with our solder paste, please contact Chip Quik? directly for no charge warranty replacement. Please retain original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes.
Printer Operation
- Print Speed: 25-125mm/sec
- Squeegee Pressure: 70-250g/cm of blade
- Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life
- >8 hours @ 20-50% RH 22-28C (72-82F)
- >4 hours @ 50-70% RH 22-28C (72-82F)
Stencil Cleaning
- Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
- Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
- This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.