Smooth Flow Leaded Solder Paste, Sn63/Pb37, T4 (250g Jar)
Printer Operation
- Print Speed: 25-125mm/sec
- Squeegee Pressure: 70-250g/cm of blade
- Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life
- >8 hours @ 20-50% RH 22-28C (72-82F)
- >4 hours @ 50-70% RH 22-28C (72-82F)
Stencil Cleaning
- Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
- Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
- This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.