• Catalog number 2290-100
• Precision temperature control unit designed for solder paste applications
• Reverse flow air technology enhances filter performance and increase life
• Process monitoring via temperature sensors that can be strategically mounted within the printer

Precision temperature control unit designed for solder paste applications.

The Temperature control unit (TCU) has been designed to meet a very specific process requirement within the electronics sector. The reliable placement of surface mount devices during PCB assembly requires that during the initial printing stage the solder paste is maintained at a temperature that ensures optimum performance.

With assembly now on a global basis, the variation of local climate and factory conditions means that this optimum level cannot be maintained without some form of intervention.

The design of the TCU includes cooling and heating elements which ensure that the temperature within the printing environment is maintained within 1ºC of the optimum paste performance temperature regardless of whether the factory ambient is above or below this level.

The RFA technology feature causes a fall in velocity and air direction change. Larger particulate falls out of the airstream into the filter’s drop-out chamber. With less particulate entering the filter media the filter life is significantly increased, enhancing filter capture performance and ensuring longer life.