NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. NC257-2 produces bright, smooth and shiny solder joints and very clear, low volume post soldering residue. NC257-2 was developed for use in air reflow but can be used in both N2 and vapor-phase reflow processes as well. NC257-2 is formulated to extend print performance and tack time in facilities where environmental control is not at its optimum.

Sn63/Pb37 Electropure is alloyed in a proprietary method resulting in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow, and reducing bridging during soldering. Applications include wave and selective soldering and plating where Sn63/Pb37 Electropure is primarily used as a coating for corrosion protection and as a base for soldering.

• Liquidus 183°C (361°F)
• High Purity
• Low Dross
• Complies with IPC J-STD-006 – Current Rev