NC266-3 is a rosin-free, resin-free, halide-free, no-clean wave solder flux designed to enhance wetting and prevent bridging during the wave soldering process. NC266-3 offers an enhanced activity level, as well as lower surface tension than other no-clean flux chemistries. NC266-3 performs well with bare copper, solder coated and organic-coated PWBs, leaving negligible post-process residues that are non-conductive and do not require cleaning. NC266-3 may be utilized with tin-lead and lead-free solder alloys.

Application

• NC266-3 is formulated for application via spray. For spraying, NC266-3 is ready to use directly from its container, no thinning is required. When spray fluxing, it is imperative that proper flux coverage and uniformity be achieved and maintained. A dry flux coating of 500 to 1500 micrograms per square inch is recommended as a starting point.
• When nitrogen-sealed wave solder equipment is used, it is generally necessary to apply slightly more flux than  normal as a result of excess drying due to the extended length of the equipment.
• Monitoring and controlling the acid number is recommended for maintaining the flux composition. The acid number should be maintained between 13.98-15.44 MG KOH/GRAM or 30– 32 drops using AIM’s N.020 Titration Kit.