The 8618 silicone-free thermal grease is a heat sink paste with high thermal conductivity and exceptional wetting properties. The thixotropic consistency helps ensure the paste conforms to the intricate geometry at the component/heatsink interface while avoiding bleed and pumping out common with other pastes. 8618 has a wide operating temperature range, making it a practical solution for needing high heat dissipation and thermal cycling stability. Once applied, circuits can be powered up immediately offering exceptional convenience.

This thermal paste is often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like thermal sensors, IGBTs, thermal wells, and power resistors.

The paste’s soft consistency allows easy compression to achieve thin bond lines, minimizing thermal resistance.

For applications demanding lower thermal conductivity, we have the 8617A, 8616, and 860. We also have a full line of thermally conductive adhesives that provide a permanent bond and thermal gels that offer tack adhesion where a low-modulus material is needed.